JPH0472641U - - Google Patents
Info
- Publication number
- JPH0472641U JPH0472641U JP11701090U JP11701090U JPH0472641U JP H0472641 U JPH0472641 U JP H0472641U JP 11701090 U JP11701090 U JP 11701090U JP 11701090 U JP11701090 U JP 11701090U JP H0472641 U JPH0472641 U JP H0472641U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- integrated circuit
- solder
- hybrid integrated
- onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11701090U JPH0472641U (en]) | 1990-11-06 | 1990-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11701090U JPH0472641U (en]) | 1990-11-06 | 1990-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472641U true JPH0472641U (en]) | 1992-06-26 |
Family
ID=31864878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11701090U Pending JPH0472641U (en]) | 1990-11-06 | 1990-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472641U (en]) |
-
1990
- 1990-11-06 JP JP11701090U patent/JPH0472641U/ja active Pending
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